The potential, positive impact AI will have on society at large is impossible to overestimate. Pervasive AI, however, remains a challenge. Training algorithms can take inordinate amounts of power, time, and computing capacity. Inference will also become more taxing with applications such as medical imaging and robotics. Applied Materials estimates that AI could consume up to 25% of global electricity (versus 5% now) unless we can achieve breakthroughs in processors, software, material science, system design, networking, and other areas.

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As security has become a must-have in most systems, hardware roots of trust (HRoTs) have started appearing in many chips. Critical to an HRoT is the ability to authenticate and to create keys – ideally from a reliable source that is unviewable and immutable.

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In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages.

Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB technology.

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